PROTECTIVE MATERIAL FOR ELECTRONIC CIRCUIT, PROTECTIVE SEALING MATERIAL FOR ELECTRONIC CIRCUIT, SEALING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Provided is a protective material for an electronic circuit that satisfies at least the conditions in (1) or (2): (1) a protective material for an electronic circuit that comprises a resin constituent and an inorganic filler, with the filler content ratio being at least 50% by mass of the whole; (2)...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAURA, Masashi, ISHIBASHI, Kenta, KAN, Donchoru, HORI, Kohji
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!