DOUBLE-SIDED ALUMINUM-BASED CIRCUIT BOARD AND FABRICATION METHOD THEREFOR

Provided are a double-sided aluminum-based circuit board and a fabrication method therefor, the method comprising the following steps: (1) using a die to stamp an aluminum material so as to form upper and lower circuit via holes on the aluminum material; (2) performing anodic oxidation on the stamped aluminum material to form an aluminum oxide insulation layer on the aluminum material, wherein ceramic electroplating may be further performed on the oxidized insulation layer if high insulation is required; (3) performing copper electroplating on the anodically oxidized aluminum material, such that the circuits on the upper and lower surfaces form a circuit conduction with each circuit via hole; and (4) performing circuit etching processing. Employing the described die stamping process may provide high efficiency and reduce costs; furthermore, the thermal conductivity of the circuit board is high, being one to twenty times of that of conventional double-sided ceramic substrates; with the present invention, the p