METHOD FOR MAKING LEAD FRAMES FOR INTEGRATED CIRCUIT PACKAGES

Described examples include a method (100) of making a semiconductor die package. The method (100) comprises arranging (118) at least one preformed die attach pad and at least two preformed leads on a lead frame carrier in a predetermined configuration to form a lead frame, attaching (120) a semicond...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HOW, You Chye
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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