PANEL LEVEL PACKAGING FOR MEMS APPLICATION

Conventional package for integration of MEMS and electronics suffer from profiles that are undesirably high to due to the thickness of the glass. Also in conventional package manufacturing, the MEMS and electronic devices are first individualized, and the individualized MEMS and electronics are comb...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PAN, Yaoling, BCHIR, Omar
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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