RESIN SEALING DEVICE, AND RESIN SEALING METHOD

The purpose of the present invention is to inhibit the entry of a foaming gas and a fine resin component into a space between a workpiece and a holding part of a first moulding die, while the workpiece is being held by the holding part of the first moulding die. The present invention is provided with: a first moulding die provided with a holding part for a workpiece having semiconductor elements mounted thereto; a second moulding die which is provided facing a placement surface of the workpiece held on the holding part of the first moulding die, said placement surface having the semiconductor elements mounted thereto, and which is provided with a cavity to which an uncured resin is supplied; a closed chamber which can be opened and closed, and which is formed between the first moulding die and the second moulding die; a drive unit which causes the first moulding die and/or the second moulding die to move towards each other relatively in the direction in which the first moulding die and the second moulding die face each other; a pressure adjustment unit which discharges or supplies air between the closed chamber and an external space, to adjust the internal pressure from ambient atmosphere to a reduced pressure atmosphere having a prescribed degree of vacuum; and a control unit which operates and controls the drive unit and the pressure adjustment unit. The holding part of the first moulding die is provided with a smooth surface which faces a non-placement surface of the workpiece at the opposite side to the placement surface. The smooth surface comprises a material which is capable of elastic deformation, and elastically deforms into a recessed shape along the non-placement surface, while the non-placement surface of the workpiece is in a state of being held by the smooth surface. The control unit implements control such that the placement surface of the workpiece and the semiconductor elements are immersed in the uncured resin in the cavity by the drive unit while the pressure of the closed chamber is in a state of having been reduced by the pressure adjustment unit, and a moulded article is formed by curing the uncured resin. L'objectif de la présente invention est d'empêcher l'entrée d'un gaz moussant et d'un composant résine fine dans un espace entre une pièce à travailler et une partie de maintien d'une première matrice de moulage, tandis que la pièce à travailler est maintenue par la partie de maintien de la première matrice de moulage. La présente i