RESIN SEALING DEVICE AND RESIN SEALING METHOD

The present invention stably molds in a manner such that pressure from a plunger compresses uncured resin without the resin penetrating to the plunger side and without producing internal air bubbles (voids). The present invention is equipped with: a first molding die having a pressing section for a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MORI Hiroharu, OHTANI Yoshikazu, TAKAHASHI Hiroshi
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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