RESIN SEALING DEVICE AND RESIN SEALING METHOD

The present invention stably molds in a manner such that pressure from a plunger compresses uncured resin without the resin penetrating to the plunger side and without producing internal air bubbles (voids). The present invention is equipped with: a first molding die having a pressing section for a workpiece having a semiconductor element mounted thereon; a second molding die having a cavity to which uncured resin is supplied and provided so as to face the workpiece mounting surface on which the semiconductor element is mounted; an openable/closable sealed chamber formed between the first molding die and the second molding die; a drive unit for moving the first molding die and/or the second molding die in a manner such that the first and second molding dies become closer relative to one another in the direction in which the dies face one another; a pressurization mechanism having a plunger for applying pressure to the uncured resin inside the cavity in the sealed chamber; and a control unit for controlling the operation of the drive unit and the plunger. Therein, the pressurization mechanism has an uncured resin overflow channel provided so as to be continuous with the cavity inside the sealed chamber, a plunger provided so as to be capable of moving and projecting toward the overflow channel, and a deformable separation part provided between the plunger and the uncured resin inside the overflow channel. Furthermore, the control unit controls the drive unit so as to immerse the workpiece mounting surface and semiconductor element in the uncured resin inside the cavity, and while in a state where the uncured resin in the cavity flows into the overflow channel in response to the immersion, causes the plunger to move and project into the overflow channel via the separation part. La présente invention permet de mouler de façon stable et d'une manière telle que la pression fournie par un piston comprime une résine non durcie sans que la résine ne pénètre côté piston et sans produire de bulles d'air internes (vides). La présente invention est équipée de : une première matrice de moulage ayant une section de pressage pour une pièce à travailler ayant un élément semi-conducteur monté sur celle-ci ; une seconde matrice de moulage ayant une cavité dans laquelle une résine non durcie est fournie et disposée de façon à faire face à la surface de montage de la pièce à travailler sur laquelle l'élément semi-conducteur est monté ; une chambre scellée pouvant être ouverte