METHOD FOR PREDICTING DEPOSITION SPEED OF SPUTTERING TARGET, SPUTTERING TARGET HAVING DEPOSITION SPEED CONTROLLED THEREBY AND METHOD FOR MANUFACTURING SAME

The present invention relates to a sputtering target and a method for manufacturing the same, the sputtering target identifying a speed index according to a structure of internal organizational characteristics thereof, predicting the deposition speed according to the speed index, and having the depo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HONG, Gil-Soo, PARK, Joo-Hyeon, KWON, Oh-Jib
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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