ELECTRONICS PACKAGE WITH EMBEDDED THROUGH-CONNECT AND RESISTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF

An electronics package includes an insulating substrate, a semiconductor device having a top surface coupled to a first side of the insulating substrate, and a pass-through structure coupled to the first side of the insulating substrate. The pass-through structure includes an insulating core, a resi...

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Bibliographische Detailangaben

Hauptverfasser:	FILLION, Raymond, MCCONNELEE, Paul, GOWDA, Arun
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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