PHOTOCATALYTIC MATERIAL AND PHOTOCATALYTIC COATING COMPOSITION

A photocatalytic material 100 which comprises a base 10 and a photocatalytic layer 20 disposed on one surface of the base. The photocatalytic layer comprises photocatalyst particles 21, copper compound particles 22 comprising copper(II) oxide and/or copper(II) hydroxide, inorganic particles 23 havin...

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Bibliographische Detailangaben
Hauptverfasser:	KATO Daiki, MIKI Shinichiro
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVES CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POLISHES THEIR RELEVANT APPARATUS TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A photocatalytic material 100 which comprises a base 10 and a photocatalytic layer 20 disposed on one surface of the base. The photocatalytic layer comprises photocatalyst particles 21, copper compound particles 22 comprising copper(II) oxide and/or copper(II) hydroxide, inorganic particles 23 having no photocatalytic activity, and an inorganic binder 24, the amount of the copper contained in the copper compound particles being 0.1-5 parts by mass per 100 parts by mass of the photocatalyst particles. The copper compound particles have been fixed so as to be in contact with the surfaces of the photocatalyst particles and inorganic particles. The present invention further provides a photocatalytic coating composition which is for forming the photocatalytic layer of said photocatalytic material. The photocatalytic coating composition comprises photocatalyst particles, a copper compound which is a precursor of copper(II) oxide and copper(II) hydroxide and which comprises a compound of a divalent copper ion, inorganic particles having no photocatalytic activity, and a precursor of an inorganic binder, the amount of the copper contained in the copper compound being 0.1-5 parts by mass per 100 parts by mass of the photocatalyst particles. L'invention concerne un matériau photocatalytique 100 qui comporte une base 10 et une couche photocatalytique 20 disposée sur une surface de la base. La couche photocatalytique comporte des particules de photocatalyseur 21, des particules de composé de cuivre 22 comportant de l'oxyde de cuivre(II) et/ou de l'hydroxyde de cuivre(II), des particules inorganiques 23 n'ayant pas d'activité photocatalytique, et un liant inorganique 24, la quantité de cuivre contenue dans les particules de composé de cuivre étant de 0,1 à 5 parties en masse pour 100 parties en masse des particules du photocatalyseur. Les particules de composé de cuivre ont été fixées de manière à être en contact avec les surfaces des particules du photocatalyseur et des particules inorganiques. La présente invention concerne en outre une composition de revêtement photocatalytique qui est destinée à former la couche photocatalytique dudit matériau photocatalytique. La composition de revêtement photocatalytique comporte des particules du photocatalyseur, un composé de cuivre qui est un précurseur d'oxyde de cuivre(II) et d'hydroxyde de cuivre(II) et qui comporte un composé d'un ion de cuivre divalent, des particules inorganiques n'ayant pas d'activité photocatalytique,