CONNECTION STRUCTURE, CIRCUIT CONNECTION MEMBER, AND ADHESIVE COMPOSITION

The present invention provides a connection structure provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member which is disposed between the first circuit member and the second circuit member an...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA Masaru, TAKETATSU Jun, KUME Masahide, MORIJIRI Tomoki
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY CURRENT COLLECTORS DYES ELECTRICITY LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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