CONNECTION STRUCTURE, CIRCUIT CONNECTION MEMBER, AND ADHESIVE COMPOSITION

The present invention provides a connection structure provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member which is disposed between the first circuit member and the second circuit member an...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TANAKA Masaru, TAKETATSU Jun, KUME Masahide, MORIJIRI Tomoki
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY CURRENT COLLECTORS DYES ELECTRICITY LINE CONNECTORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides a connection structure provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member which is disposed between the first circuit member and the second circuit member and which electrically connects the first circuit electrode and the second circuit electrode to each other, wherein the linear thermal expansion amount L(t) of the circuit connection member at temperature (t) satisfies the condition dL(t)/dt