SEMI-AROMATIC COPOLYAMIDE RESIN AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF SEMI-AROMATIC COPOLYAMIDE RESIN
Disclosed are a semi-aromatic copolyamide resin and a polyamide molding composition consisting of the semi-aromatic copolyamide resin. The semi-aromatic copolyamide resin consists of the following repeat units: (A) 26-80 mol% of units derived from para-aminobenzoic acid; (B) 0-37 mol% of units deriv...
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Format: | Patent |
Sprache: | chi ; eng ; fre |
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Zusammenfassung: | Disclosed are a semi-aromatic copolyamide resin and a polyamide molding composition consisting of the semi-aromatic copolyamide resin. The semi-aromatic copolyamide resin consists of the following repeat units: (A) 26-80 mol% of units derived from para-aminobenzoic acid; (B) 0-37 mol% of units derived from diamine having 4-36 carbon atoms; (C) 0-37 mol% of units derived from diacid having 6-36 carbon atoms; and (D) 0-74 mol% of units derived from amino acid or lactam having 6-36 carbon atoms, wherein (A)+(B)+(C)+(D)=100 mol%, and the (D) units do not comprise units derived from 11-aminoundecanoic acid or 11-lactam. The semi-aromatic copolyamide resin of the present invention, obtained by replacing terephthalic acid with a para-aminobenzoic acid monomer and controlling the content of para-aminobenzoic acid units, has high heat resistance, high thermal stability, good fluidity, and low water absorption rate. The polyamide molding composition consisting of the semi-aromatic copolyamide resin also has obvious per |
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