ELECTRONIC DEVICE COMPRISING METAL CASE HAVING METAL PAD ATTACHED THERETO

An electronic device comprising a metal case having a metal pad attached thereto is disclosed. According to the present invention, the electronic device comprises: a metal case having a metal terminal part formed therein; a metal pad joined to the metal terminal part by laser welding; and a conducti...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, Seung-yup, KOO, Ja-myeong, LEE, Young-chul, KIM, Tae-hyeong, YOON, Jeong-gen, KIM, Myeong-hwa, MOON, Yeon-kwan, SEO, Min-goo
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An electronic device comprising a metal case having a metal pad attached thereto is disclosed. According to the present invention, the electronic device comprises: a metal case having a metal terminal part formed therein; a metal pad joined to the metal terminal part by laser welding; and a conductive first coating layer coated on one surface of the metal pad, wherein the light reflectivity of the first coating layer is lower than the light reflectivity of the metal pad. L'invention concerne un dispositif électronique comprenant un boîtier métallique sur lequel est fixé une plage métallique. Selon la présente invention, le dispositif électronique comprend : un boîtier métallique ayant une partie de borne métallique formée à l'intérieur de celui-ci; une plage métallique jointe à la partie de borne métallique par soudage au laser; et une première couche de revêtement conductrice appliquée sur une surface de la plage métallique, la réflectivité de la lumière de la première couche de revêtement étant inférieure à la réflectivité de lumière de la plage métallique. 금속 패드가 부착되는 금속 케이스를 구비한 전자기기가 개시된다. 본 발명에 따른 전자기기는 금속 단자부가 형성된 금속 케이스; 상기 금속 단자부에 레이저 용접에 의해 접합되는 금속 패드; 및 상기 금속 패드의 일면에 코팅된 도전성 제1 코팅층;을 포함하며, 상기 제1 코팅층의 광 반사율은 상기 금속 패드의 광 반사율보다 낮다.