RESISTIVITY STANDARD SAMPLE MANUFACTURING METHOD AND EPITAXIAL WAFER RESISTIVITY MEASURING METHOD

The present invention provides a resistivity standard sample manufacturing method comprising: a step of preparing a first conductivity-type silicon single-crystalline substrate; a step of measuring, using a thickness measuring device traceable to a national standard, the thickness of the silicon sin...

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1. Verfasser: KUME Fumitaka
Format: Patent
Sprache:eng ; fre ; jpn
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