REARWARD ACOUSTIC DIFFUSION ULTRASOUND-ON-A-CHIP TRANSDUCER ARRAY
A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon. Un dissipateur thermique a une surface...
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| Format: | Patent |
| Sprache: | eng ; fre |
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| Zusammenfassung: | A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.
Un dissipateur thermique a une surface de montage non plane, et un substrat de transducteur ultrasonore fixé à la surface de montage. La surface de montage diffuse des ondes acoustiques qui sont incidentes sur celui-ci. |
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