TRANSDUCER PACKAGE WITH THROUGH-VIAS

A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electri...

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Bibliographische Detailangaben
1. Verfasser: LOEPPERT, Pete
Format: Patent
Sprache:eng ; fre
Schlagworte:
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