TRANSDUCER PACKAGE WITH THROUGH-VIAS
A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electri...
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Format: | Patent |
Sprache: | eng ; fre |
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