ROBUST LOW INDUCTANCE POWER MODULE PACKAGE

A method and system for a power module is provided. The power module includes a first substrate (102) including a first conductive substrate (114) having a first plurality of power semiconductor switches (122) arranged thereon, and at least one second conductive substrate (116) electrically coupled...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ROWDEN, Brian, Lynn, STEVANOVIC, Ljubisa, Dragoljub
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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