BATCH MANUFACTURE OF COMPONENT CARRIERS

A method of manufacturing a batch of component carriers (600), wherein the method comprises providing a plurality of separate wafer structures (400), each comprising a plurality of electronic components (402), simultaneously laminating the wafer structures (400) with at least one electrically conduc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MOITZI, Heinz, DROFENIK, Dietmar
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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