REACTIVE HOT MELT ADHESIVE COMPOSITION

The present invention relates to a process for preparing a reactive hotmelt adhesive formulation having a low residual content of monomeric diisocyanate. The present invention further provides a reactive hotmelt adhesive composition obtainable by the process of the invention. La présente invention c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LINEMANN, Annett, BENNOUR, Haythem
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to a process for preparing a reactive hotmelt adhesive formulation having a low residual content of monomeric diisocyanate. The present invention further provides a reactive hotmelt adhesive composition obtainable by the process of the invention. La présente invention concerne un procédé de préparation d'une formulation adhésive thermofusible réactive ayant une faible teneur résiduelle en diisocyanate monomère. La présente invention concerne en outre une composition adhésive thermofusible réactive pouvant être obtenue selon le procédé de l'invention.