FINE COPPER PARTICLE DISPERSION LIQUID, ELECTROCONDUCTIVE FILM FORMATION METHOD, AND CIRCUIT BOARD

A fine copper particle dispersion liquid is characterized by having: first fine copper particles having a median particle diameter of 1-100 nm; second fine copper particles having a median particle diameter that is greater than or equal to 0.3 µm and less than 2 µm; a resin in a concentration greate...

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Bibliographische Detailangaben
Hauptverfasser:	MINAMIHARA, Satoshi, KUDO, Tomio, KAWATO, Yuichi
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES POWDER METALLURGY PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING METALLIC POWDER
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