SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR

Disclosed is a semiconductor light-emitting element comprising: a body including a bottom part and having at least one hole formed in the bottom part; a semiconductor light-emitting chip located in each of the at least one hole, and having a plurality of semiconductor layers including an active laye...

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Bibliographische Detailangaben
Hauptverfasser: KIM, Kyoung Min, CHO, Young Kwan, JEONG, Gye Oul, JUNG, Dong So, PARK, Eung Suk, BAEK, Seung Ho, JEON, Soo Kun, RHEE, hye Ji, PARK, Eun Hyun
Format: Patent
Sprache:eng ; fre ; kor
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Zusammenfassung:Disclosed is a semiconductor light-emitting element comprising: a body including a bottom part and having at least one hole formed in the bottom part; a semiconductor light-emitting chip located in each of the at least one hole, and having a plurality of semiconductor layers including an active layer for generating light by the rebonding of electrons and holes, and an electrode electrically connected to the plurality of semiconductor layers; and an encapsulation material covering the semiconductor light-emitting chip, wherein an inner side surface of the bottom part in which the hole is formed has a plurality of angles of inclination. L'invention concerne un élément électroluminescent à semi-conducteur comprenant : un corps comprenant une partie inférieure et comportant au moins un trou formé dans la partie inférieure; une puce électroluminescente à semi-conducteur située dans chacun du ou des trous, et comportant une pluralité de couches semi-conductrices y compris une couche active pour générer de la lumière par recombinaison d'électrons et de trous, et une électrode connectée électriquement à la pluralité de couches semi-conductrices; et un matériau d'encapsulation recouvrant la puce électroluminescente à semi-conducteur, une surface côté intérieur de la partie inférieure dans laquelle le trou est formé présentant une pluralité d'angles d'inclinaison. 본 개시는, 반도체 발광소자에 있어서, 바닥부를 포함하는 몸체;로서, 바닥부에 적어도 하나 이상의 홀이 형성된 몸체; 적어도 하나 이상의 홀 각각에 위치하는 반도체 발광소자 칩;으로서, 전자와 정공의 재결합에 의해 빛을 생성하는 활성층을 포함하는 복수의 반도체층과, 복수의 반도체층에 전기적으로 연결된 전극을 구비하는 반도체 발광소자 칩; 그리고, 반도체 발광소자 칩을 덮는 봉지재;를 포함하며, 홀을 형성하는 바닥부 내측면이 복수의 경사각을 갖는 것을 특징으로 하는 반도체 발광소자에 관한 것이다.