ELECTRONIC DEVICE AND METHOD OF MAKING THE SAME USING SURFACE MOUNT TECHNOLOGY AND AN ANISOTROPIC CONDUCTIVE ADHESIVE USEFUL IN THE METHOD

A method of and system (200) for manufacturing an electronic device (300, 300'), a curable conductive adhesive for use in the same, and an electronic device (300, 300') are disclosed. The method includes printing a conductive adhesive onto pads at ends of traces on a substrate (310, 360), placing one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape (e.g. circular, oval or rectangular with rounded corners) onto the pads with the conductive adhesive thereon, and after the component(s) (320, 340, 340', 350, 355) have been placed onto the pads, curing the conductive adhesive at a predetermined temperature or with light having a predetermined wavelength (band). The one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape may be an antenna (320), a sensor (340, 340') and/or a display (350, 355). The electronic device (300, 300') may further comprise one or more additional components (330, 335, 370) having a standard size and/or shape on a second subset of the pads. The additional components (330, 335, 370) may be an integrated circuit (330, 335) and/or a battery (370). The system (200) comprises a printer (220) configured to print a conductive adhesive onto pads at ends of traces on a substrate, a surface mounting (SMT) machine (230) configured to place one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and a curing station configured to cure the conductive adhesive after the component(s) (320, 340, 340', 350, 355) have been placed onto the pads. The SMT machine (230) may include a nozzle head having a surface with a shape identical to or configured to match a shape of the component (320, 340, 340', 350, 355) it picks up. La présente invention concerne un procédé et un système (200) de fabrication d'un dispositif électronique (300, 300'), un adhésif conducteur durcissable destiné à être utilisé dans celui-ci, et un dispositif électronique (300, 300'). Le procédé comprend l'impression d'un adhésif conducteur sur des plages à des extrémités de traces sur un substrat (310, 360), le placement d'un ou de plusieurs composants (320, 340, 340', 350, 355) qui présentent une taille et/ou une forme non standard (par exemple, une forme circulaire, ovale ou rectangulaire avec des coins arrondis) sur les plages avec l'adhésif conducteur sur celles-ci, et après que le ou les composants (320, 340, 340', 350, 355) ont ét