CONDITIONING DISKS FOR CHEMICAL MECHANICAL POLISHING

Disclosed herein are chemical mechanical polishing (CMP) conditioning disks, systems, and techniques. For example, in some embodiments, a CMP conditioning disk may include: a support having a surface; a projection secured to the support and extending away from the surface; and an abrasive material d...

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Bibliographische Detailangaben
Hauptverfasser:	MANSSON, Andrew Paul, GARLAND, John E, DHILLON, Gunnmeet S, TREGUB, Alexander, DELBRIDGE, Kenneth A
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed herein are chemical mechanical polishing (CMP) conditioning disks, systems, and techniques. For example, in some embodiments, a CMP conditioning disk may include: a support having a surface; a projection secured to the support and extending away from the surface; and an abrasive material disposed on the surface and on the projection. La présente invention concerne des disques de conditionnement pour polissage mécano-chimique (CMP), des systèmes et des techniques. Par exemple, dans certains modes de réalisation, un disque de conditionnement pour CMP peut comporter : un support qui présente une surface ; une saillie qui est fixée au support et qui s'étend à partir de la surface ; et un matériau abrasif disposé sur la surface et sur la saillie.