FINGERPRINT RECOGNITION SENSOR PACKAGE AND METHOD FOR MANUFACTURING SAME
Disclosed is a fingerprint recognition sensor package. The fingerprint recognition sensor package of the present invention comprises: a base substrate; a fingerprint recognition sensor chip mounted on an upper surface of the base substrate; and a molding unit for covering and sealing the fingerprint...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | JUNG, Ji Sung SONG, Yong Hwan HU, Jae Sok SHIM, Hyun Sup MIN, Bin Hong |
| description | Disclosed is a fingerprint recognition sensor package. The fingerprint recognition sensor package of the present invention comprises: a base substrate; a fingerprint recognition sensor chip mounted on an upper surface of the base substrate; and a molding unit for covering and sealing the fingerprint recognition sensor chip and the upper surface of the base substrate, wherein the side surfaces of the base substrate are formed as cutting surfaces, and at least a part of the side surfaces of the molding unit are formed as a laser-cutting surface.
La présente invention concerne un boîtier détecteur de reconnaissance d'empreintes digitales. Le boîtier détecteur de reconnaissance d'empreintes digitales de la présente invention comprend : un substrat de base; une puce de détecteur de reconnaissance d'empreintes digitales montée sur une surface supérieure du substrat; et une unité de modelage destinée à recouvrir et à sceller la puce de détecteur de reconnaissance d'empreintes digitales et la surface supérieure du substrat de base, les surfaces latérales du substrat de base étant formées comme des surfaces de coupe, et au moins une partie des surfaces latérales de l'unité de modelage sont formées comme une surface de coupe au laser.
지문인식 센서 패키지가 개시된다. 본 발명의 지문인식 센서 패키지는 베이스 기판, 상기 베이스 기판의 상면에 실장된 지문인식 센서 칩 및 상기 지문인식 센서 칩 및 상기 베이스 기판의 상면을 덮으며 봉지하는 몰딩부를 포함하고, 상기 베이스 기판의 측면은 절삭면으로 형성되고, 상기 몰딩부의 측면 중 적어도 일부는 레이저 절단면으로 형성된다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2017146451A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2017146451A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2017146451A13</originalsourceid><addsrcrecordid>eNrjZPBw8_Rzdw0KCPL0C1EIcnX2d_fzDPH091MIdvUL9g9SCHB09nZ0d1Vw9HNR8HUN8fB3UXADCvs6-oW6OTqHhAL1uSsEO_q68jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-HB_IwNDc0MTMxNTQ0dDY-JUAQDQGS3h</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FINGERPRINT RECOGNITION SENSOR PACKAGE AND METHOD FOR MANUFACTURING SAME</title><source>esp@cenet</source><creator>JUNG, Ji Sung ; SONG, Yong Hwan ; HU, Jae Sok ; SHIM, Hyun Sup ; MIN, Bin Hong</creator><creatorcontrib>JUNG, Ji Sung ; SONG, Yong Hwan ; HU, Jae Sok ; SHIM, Hyun Sup ; MIN, Bin Hong</creatorcontrib><description>Disclosed is a fingerprint recognition sensor package. The fingerprint recognition sensor package of the present invention comprises: a base substrate; a fingerprint recognition sensor chip mounted on an upper surface of the base substrate; and a molding unit for covering and sealing the fingerprint recognition sensor chip and the upper surface of the base substrate, wherein the side surfaces of the base substrate are formed as cutting surfaces, and at least a part of the side surfaces of the molding unit are formed as a laser-cutting surface.
La présente invention concerne un boîtier détecteur de reconnaissance d'empreintes digitales. Le boîtier détecteur de reconnaissance d'empreintes digitales de la présente invention comprend : un substrat de base; une puce de détecteur de reconnaissance d'empreintes digitales montée sur une surface supérieure du substrat; et une unité de modelage destinée à recouvrir et à sceller la puce de détecteur de reconnaissance d'empreintes digitales et la surface supérieure du substrat de base, les surfaces latérales du substrat de base étant formées comme des surfaces de coupe, et au moins une partie des surfaces latérales de l'unité de modelage sont formées comme une surface de coupe au laser.
지문인식 센서 패키지가 개시된다. 본 발명의 지문인식 센서 패키지는 베이스 기판, 상기 베이스 기판의 상면에 실장된 지문인식 센서 칩 및 상기 지문인식 센서 칩 및 상기 베이스 기판의 상면을 덮으며 봉지하는 몰딩부를 포함하고, 상기 베이스 기판의 측면은 절삭면으로 형성되고, 상기 몰딩부의 측면 중 적어도 일부는 레이저 절단면으로 형성된다.</description><language>eng ; fre ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING RECORD CARRIERS ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170831&DB=EPODOC&CC=WO&NR=2017146451A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170831&DB=EPODOC&CC=WO&NR=2017146451A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JUNG, Ji Sung</creatorcontrib><creatorcontrib>SONG, Yong Hwan</creatorcontrib><creatorcontrib>HU, Jae Sok</creatorcontrib><creatorcontrib>SHIM, Hyun Sup</creatorcontrib><creatorcontrib>MIN, Bin Hong</creatorcontrib><title>FINGERPRINT RECOGNITION SENSOR PACKAGE AND METHOD FOR MANUFACTURING SAME</title><description>Disclosed is a fingerprint recognition sensor package. The fingerprint recognition sensor package of the present invention comprises: a base substrate; a fingerprint recognition sensor chip mounted on an upper surface of the base substrate; and a molding unit for covering and sealing the fingerprint recognition sensor chip and the upper surface of the base substrate, wherein the side surfaces of the base substrate are formed as cutting surfaces, and at least a part of the side surfaces of the molding unit are formed as a laser-cutting surface.
La présente invention concerne un boîtier détecteur de reconnaissance d'empreintes digitales. Le boîtier détecteur de reconnaissance d'empreintes digitales de la présente invention comprend : un substrat de base; une puce de détecteur de reconnaissance d'empreintes digitales montée sur une surface supérieure du substrat; et une unité de modelage destinée à recouvrir et à sceller la puce de détecteur de reconnaissance d'empreintes digitales et la surface supérieure du substrat de base, les surfaces latérales du substrat de base étant formées comme des surfaces de coupe, et au moins une partie des surfaces latérales de l'unité de modelage sont formées comme une surface de coupe au laser.
지문인식 센서 패키지가 개시된다. 본 발명의 지문인식 센서 패키지는 베이스 기판, 상기 베이스 기판의 상면에 실장된 지문인식 센서 칩 및 상기 지문인식 센서 칩 및 상기 베이스 기판의 상면을 덮으며 봉지하는 몰딩부를 포함하고, 상기 베이스 기판의 측면은 절삭면으로 형성되고, 상기 몰딩부의 측면 중 적어도 일부는 레이저 절단면으로 형성된다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HANDLING RECORD CARRIERS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBw8_Rzdw0KCPL0C1EIcnX2d_fzDPH091MIdvUL9g9SCHB09nZ0d1Vw9HNR8HUN8fB3UXADCvs6-oW6OTqHhAL1uSsEO_q68jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-HB_IwNDc0MTMxNTQ0dDY-JUAQDQGS3h</recordid><startdate>20170831</startdate><enddate>20170831</enddate><creator>JUNG, Ji Sung</creator><creator>SONG, Yong Hwan</creator><creator>HU, Jae Sok</creator><creator>SHIM, Hyun Sup</creator><creator>MIN, Bin Hong</creator><scope>EVB</scope></search><sort><creationdate>20170831</creationdate><title>FINGERPRINT RECOGNITION SENSOR PACKAGE AND METHOD FOR MANUFACTURING SAME</title><author>JUNG, Ji Sung ; SONG, Yong Hwan ; HU, Jae Sok ; SHIM, Hyun Sup ; MIN, Bin Hong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2017146451A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HANDLING RECORD CARRIERS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JUNG, Ji Sung</creatorcontrib><creatorcontrib>SONG, Yong Hwan</creatorcontrib><creatorcontrib>HU, Jae Sok</creatorcontrib><creatorcontrib>SHIM, Hyun Sup</creatorcontrib><creatorcontrib>MIN, Bin Hong</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JUNG, Ji Sung</au><au>SONG, Yong Hwan</au><au>HU, Jae Sok</au><au>SHIM, Hyun Sup</au><au>MIN, Bin Hong</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FINGERPRINT RECOGNITION SENSOR PACKAGE AND METHOD FOR MANUFACTURING SAME</title><date>2017-08-31</date><risdate>2017</risdate><abstract>Disclosed is a fingerprint recognition sensor package. The fingerprint recognition sensor package of the present invention comprises: a base substrate; a fingerprint recognition sensor chip mounted on an upper surface of the base substrate; and a molding unit for covering and sealing the fingerprint recognition sensor chip and the upper surface of the base substrate, wherein the side surfaces of the base substrate are formed as cutting surfaces, and at least a part of the side surfaces of the molding unit are formed as a laser-cutting surface.
La présente invention concerne un boîtier détecteur de reconnaissance d'empreintes digitales. Le boîtier détecteur de reconnaissance d'empreintes digitales de la présente invention comprend : un substrat de base; une puce de détecteur de reconnaissance d'empreintes digitales montée sur une surface supérieure du substrat; et une unité de modelage destinée à recouvrir et à sceller la puce de détecteur de reconnaissance d'empreintes digitales et la surface supérieure du substrat de base, les surfaces latérales du substrat de base étant formées comme des surfaces de coupe, et au moins une partie des surfaces latérales de l'unité de modelage sont formées comme une surface de coupe au laser.
지문인식 센서 패키지가 개시된다. 본 발명의 지문인식 센서 패키지는 베이스 기판, 상기 베이스 기판의 상면에 실장된 지문인식 센서 칩 및 상기 지문인식 센서 칩 및 상기 베이스 기판의 상면을 덮으며 봉지하는 몰딩부를 포함하고, 상기 베이스 기판의 측면은 절삭면으로 형성되고, 상기 몰딩부의 측면 중 적어도 일부는 레이저 절단면으로 형성된다.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; kor |
| recordid | cdi_epo_espacenet_WO2017146451A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES |
| title | FINGERPRINT RECOGNITION SENSOR PACKAGE AND METHOD FOR MANUFACTURING SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T08%3A19%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JUNG,%20Ji%20Sung&rft.date=2017-08-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2017146451A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |