FRAME PACKAGE STRUCTURE OF INTEGRATED PASSIVE DEVICE AND MANUFACTURING METHOD THEREOF

A frame package structure of an integrated passive device and a manufacturing method thereof. The frame package structure of an integrated passive device comprises: a die paddle (102), a first insulation medium layer (103) disposed below the die paddle, a metal structure layer (104) disposed below the first insulation medium layer, a second insulation medium layer (103) disposed below the metal structure layer, and at least one electrically conductive soldering pad (101) disposed around the surrounding of the die paddle, wherein the at least one electrically conductive soldering pad is connected to the second insulation medium layer; at least one active chip (201) is disposed on the die paddle; and the at least one active chip (201) is electrically connected to the at least one electrically conducting soldering pad. L'invention concerne une structure de boîtier à cadre d'un dispositif passif intégré et son procédé de fabrication. La structure de boîtier à cadre d'un dispositif passif intégré comprend : une pl