WARPAGE MITIGATION IN PRINTED CIRCUIT BOARD ASSEMBLIES

Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AOKI, Russell S, JASNIEWSKI, Joseph J, CEURTER, Kevin J, CARSTENS, Jonathon Robert, HUI, Michael, FERGUSON, Shelby, YEE, Rashelle
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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