INTEGRATED CIRCUIT PACKAGES WITH TEMPERATURE SENSOR TRACES

Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AOKI, Russell S, JASNIEWSKI, Joseph J, CARSTENS, Jonathon Robert, HUI, Michael, FERGUSON, Shelby, YEE, Rashelle
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!