ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER

An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AKKINEPALLY, Praneeth, SANKMAN, Robert L, YAZZIE, Kyle, MALATKAR, Pramod, LI, Yonggang, WAN, Xuefei, SENEVIRATNE, Dilan, YAGNAMURTHY, Naga Sivakumar, HARRIES, Richard J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!