CHIP-ON-FILM STRUCTURE AND LIQUID CRYSTAL PANEL HAVING THE CHIP-ON-FILM STRUCTURE

A chip-on-film structure and a liquid crystal panel having the chip-on-film structure. The structure comprises: a film (11), wherein a group of input end leads (111) and a group of output end leads (113) are arranged thereon, and a bonding portion (115) is formed at a tail end of each of the output...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	GUO, Dongsheng, SONG, Haiman
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A chip-on-film structure and a liquid crystal panel having the chip-on-film structure. The structure comprises: a film (11), wherein a group of input end leads (111) and a group of output end leads (113) are arranged thereon, and a bonding portion (115) is formed at a tail end of each of the output end leads (113); and a driving chip (13) arranged on the film (10) and electrically connected to the input end leads (111) and the output end leads (113), wherein a connection point between the bonding portion (115) and a tail end of a corresponding output end lead (113) is defined as A, and a position, away from the tail end of the corresponding output end lead (113), of the bonding portion (115) is defined as B, a distance between A and B is L, and then, the area of the bonding portion (115) is greater than the area of the output end lead (113) corresponding thereto under the length L. By means of the chip (13) on film (11) structure, a bonding yield rate can be improved and the manufacturing cost can be reduced.