STRUCTURE AND METHOD OF FABRICATING THREE-DIMENSIONAL (3D) METAL-INSULATOR-METAL (MIM) CAPACITOR AND RESISTOR IN SEMI-ADDITIVE PLATING METAL WIRING

Methods of processing a substrate include: providing a substrate having a polymer dielectric layer, a metal pad formed within the polymer dielectric layer and a first metal layer formed atop the polymer dielectric layer; depositing a polymer layer atop the substrate; patterning the polymer layer to...

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Bibliographische Detailangaben
Hauptverfasser:	SEE, Guan Huei, MORI, Glen T, TOH, Chin Hock, SUNDARRAJAN, Arvind
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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