METHOD FOR PRODUCING COMPOSITE SUBSTRATES
A method of forming a substrate in a thermal compression bonding process that permit substantially greater amounts of fillers than previously accomplished. The method employs a dispersion of a thermoplastic binder and a filler. The dispersion is then thermally compression bonded to form a substrate....
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| creator | CERNOHOUS, Jeffrey, Jacob |
| description | A method of forming a substrate in a thermal compression bonding process that permit substantially greater amounts of fillers than previously accomplished. The method employs a dispersion of a thermoplastic binder and a filler. The dispersion is then thermally compression bonded to form a substrate. Lightweight fillers are one example of fillers that are ideally suited for the thermal compression bonding through the use of a dispersion. Such lightweight fillers enable the formation of a substrate with a very low and desirable specific gravity.
La présente invention concerne un procédé de formation d'un substrat selon un traitement de liaison par compression thermique permettant d'obtenir des quantités sensiblement supérieures de charges que précédemment. Le procédé utilise une dispersion d'un liant thermoplastique et d'une charge. La dispersion est ensuite liée par compression thermique de sorte à former un substrat. Des charges légères constituent un exemple de charges qui sont idéalement appropriées pour la liaison par compression thermique par le biais de l'utilisation d'une dispersion. De telles charges légères permettent la formation d'un substrat présentant un poids spécifique très faible et souhaitable. |
| format | Patent |
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La présente invention concerne un procédé de formation d'un substrat selon un traitement de liaison par compression thermique permettant d'obtenir des quantités sensiblement supérieures de charges que précédemment. Le procédé utilise une dispersion d'un liant thermoplastique et d'une charge. La dispersion est ensuite liée par compression thermique de sorte à former un substrat. Des charges légères constituent un exemple de charges qui sont idéalement appropriées pour la liaison par compression thermique par le biais de l'utilisation d'une dispersion. De telles charges légères permettent la formation d'un substrat présentant un poids spécifique très faible et souhaitable.</description><language>eng ; fre</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170413&DB=EPODOC&CC=WO&NR=2017062815A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170413&DB=EPODOC&CC=WO&NR=2017062815A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CERNOHOUS, Jeffrey, Jacob</creatorcontrib><title>METHOD FOR PRODUCING COMPOSITE SUBSTRATES</title><description>A method of forming a substrate in a thermal compression bonding process that permit substantially greater amounts of fillers than previously accomplished. The method employs a dispersion of a thermoplastic binder and a filler. The dispersion is then thermally compression bonded to form a substrate. Lightweight fillers are one example of fillers that are ideally suited for the thermal compression bonding through the use of a dispersion. Such lightweight fillers enable the formation of a substrate with a very low and desirable specific gravity.
La présente invention concerne un procédé de formation d'un substrat selon un traitement de liaison par compression thermique permettant d'obtenir des quantités sensiblement supérieures de charges que précédemment. Le procédé utilise une dispersion d'un liant thermoplastique et d'une charge. La dispersion est ensuite liée par compression thermique de sorte à former un substrat. Des charges légères constituent un exemple de charges qui sont idéalement appropriées pour la liaison par compression thermique par le biais de l'utilisation d'une dispersion. De telles charges légères permettent la formation d'un substrat présentant un poids spécifique très faible et souhaitable.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND0dQ3x8HdRcPMPUggI8ncJdfb0c1dw9vcN8A_2DHFVCA51Cg4JcgxxDeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGhuYGZkYWhqaOhsbEqQIA27Allg</recordid><startdate>20170413</startdate><enddate>20170413</enddate><creator>CERNOHOUS, Jeffrey, Jacob</creator><scope>EVB</scope></search><sort><creationdate>20170413</creationdate><title>METHOD FOR PRODUCING COMPOSITE SUBSTRATES</title><author>CERNOHOUS, Jeffrey, Jacob</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2017062815A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2017</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>CERNOHOUS, Jeffrey, Jacob</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CERNOHOUS, Jeffrey, Jacob</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PRODUCING COMPOSITE SUBSTRATES</title><date>2017-04-13</date><risdate>2017</risdate><abstract>A method of forming a substrate in a thermal compression bonding process that permit substantially greater amounts of fillers than previously accomplished. The method employs a dispersion of a thermoplastic binder and a filler. The dispersion is then thermally compression bonded to form a substrate. Lightweight fillers are one example of fillers that are ideally suited for the thermal compression bonding through the use of a dispersion. Such lightweight fillers enable the formation of a substrate with a very low and desirable specific gravity.
La présente invention concerne un procédé de formation d'un substrat selon un traitement de liaison par compression thermique permettant d'obtenir des quantités sensiblement supérieures de charges que précédemment. Le procédé utilise une dispersion d'un liant thermoplastique et d'une charge. La dispersion est ensuite liée par compression thermique de sorte à former un substrat. Des charges légères constituent un exemple de charges qui sont idéalement appropriées pour la liaison par compression thermique par le biais de l'utilisation d'une dispersion. De telles charges légères permettent la formation d'un substrat présentant un poids spécifique très faible et souhaitable.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | METHOD FOR PRODUCING COMPOSITE SUBSTRATES |
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