ELECTRONIC COMPONENT ASSEMBLY WITH LEADS AND MANUFACTURING METHOD THEREFOR

Disclosed are an electronic component assembly with leads and a manufacturing method therefor, in which bonding strength is guaranteed while a short circuit fault is unlikely to occur. The electronic component assembly with leads comprises: an electronic component, on which terminal electrodes (2a,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHOU, Jie, TSUBAKI, Shuji, HAMURO, Yoshimitsu
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
Online-Zugang:	Volltext bestellen
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