ELECTRONIC COMPONENT ASSEMBLY WITH LEADS AND MANUFACTURING METHOD THEREFOR

Disclosed are an electronic component assembly with leads and a manufacturing method therefor, in which bonding strength is guaranteed while a short circuit fault is unlikely to occur. The electronic component assembly with leads comprises: an electronic component, on which terminal electrodes (2a, 2b) are respectively formed at two ends of an electronic component body; and first and second leads (5a, 5b) formed by insulated members (7a, 7b) wrapping metal wires (6a, 6b) and arranged in parallel, wherein the first and second leads (5a, 5b) are electrically connected to the terminal electrodes (2a, 2b) respectively. On bonding faces of the first and second leads (5a, 5b) located at the same side and used for bonding to the terminal electrodes (2a, 2b), metal wire exposure portions (3a, 3b) which enable the metal wires (6a, 6b) to respectively be exposed from the first and second leads (5a, 5b) are provided, and the metal wire exposure portion (3a) of the first lead (5a) and the metal wire exposure portion (3b)