METHOD FOR GLUING INVOLVING THE USE OF A RADIATION CURABLE ADHESIVE COMPOSITION COMPRISING SHORT FIBERS

The present patent application relates to a method for gluing two adjacent substrates together by using a radiation curable adhesive composition and a use of a radiation curable adhesive composition for gluing. In particular, the method for gluing involves the use of a radiation curable adhesive com...

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Bibliographische Detailangaben
Hauptverfasser:	CAPPELLE, Steven, VANMEULDER, Guido, VIEIRA, Paulo
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BUILDING CHEMISTRY DECORATIVE ARTS DYES FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS FIXED CONSTRUCTIONS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MICROSTRUCTURAL TECHNOLOGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MOSAICS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PAPERHANGING PERFORMING OPERATIONS POLISHES PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS PRODUCING DECORATIVE EFFECTS TARSIA WORK TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present patent application relates to a method for gluing two adjacent substrates together by using a radiation curable adhesive composition and a use of a radiation curable adhesive composition for gluing. In particular, the method for gluing involves the use of a radiation curable adhesive composition which comprises from 0.1 wt.% to 30 wt.% of fibers compared to the total weight of the radiation curable adhesive composition, wherein the fibers have a length comprised from 100 microns to 50 mm. La présente invention concerne un procédé de collage entre eux de deux substrats adjacents à l'aide d'une composition adhésive durcissable par rayonnement et une utilisation d'une composition adhésive durcissable par rayonnement destinée audit collage. En particulier, le procédé de collage implique l'utilisation d'une composition adhésive durcissable par rayonnement qui comprend de 0,1 % en poids à 30 % en poids de fibres par rapport au poids total de ladite composition adhésive durcissable par rayonnement, lesdites fibres présentant une longueur située dans la plage allant de 100 microns à 50 mm.