LAYERED WIRING FORMING METHOD

Provided is a layered wiring forming method that enables forming of layered wiring, efficiently. The present invention is a layered wiring forming method comprising: a step for preparing a substrate having a first conductive layer as the outermost layer; a step for forming, on the surface of the sub...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAMAGUCHI Hitoshi, TANAKA Kenrou
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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