PROCESSING CHAMBER HAVING A COOLING DEVICE AND A METHOD FOR COOLING A SUBSTRATE IN A PROCESSING CHAMBER

The present disclosure provides a processing chamber. The processing chamber includes a substrate carrier (110) configured to support a substrate (101) having a surface (101a) with a surface area (A), a deposition source (120), and a cooling device (130), wherein at least one of the substrate carrie...

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Bibliographische Detailangaben
1. Verfasser:	SCHNAPPENBERGER, Frank
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present disclosure provides a processing chamber. The processing chamber includes a substrate carrier (110) configured to support a substrate (101) having a surface (101a) with a surface area (A), a deposition source (120), and a cooling device (130), wherein at least one of the substrate carrier (110) and the cooling device (130) is configured to be moveable to a cooling position. La présente invention concerne une chambre de traitement. La chambre de traitement comprend : un support de substrat (110), conçu pour servir de support à un substrat (101) pourvu d'une surface (101a) comprenant une zone de surface (A), une source de dépôt (120) et un dispositif de refroidissement (130), le support de substrat (110) et/ou le dispositif de refroidissement (130) étant conçu(s) pour être déplacé(s) vers une position de refroidissement.