THERMALLY CONDUCTIVE INTERFACE FORMULATIONS AND METHODS THEREOF

Provided herein are thermally-conductive interface material formulations having advantageous properties for use within the electronics industry and other industrial applications (e.g. in die attach semiconductor packages, wafer applied underfill film, non-conductive paste, and thermal interface mate...

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Bibliographische Detailangaben
Hauptverfasser:	WANG, Yongfeng, CHAU, Hung, SUNDERMEIER, Uta, BAI, Jie, KIM, Younsang
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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