THERMALLY CONDUCTIVE ADHESIVE

The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KOPANNIA, Siegfried, SCHUBERT, Carsten, MARKIEFKA, Patrick, BUTTERBACH, Rüdiger, SIEPENKOTHEN, Judith
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein. La présente invention concerne des adhésifs thermofusibles présentant une conductivité thermique améliorée, leurs utilisations et des procédés pour la fabrication d'articles présentant une conductivité thermique améliorée utilisant lesdites compositions adhésives. Les compositions adhésives de la présente invention comprennent au moins un liant (co)polymère et une combinaison de différentes charges, tels que définis dans la description.