CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH
A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the con...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TRAN, HOANG VI KIM, ESTHER CATIVO, MA HELEN SUMMERS, JOHN DONALD TAO, YUEFEI WOLFE, MICHAEL STEPHEN MATHER, BRIAN D SAUER, BRYAN BENEDICT LEE, HEE HYUN |
| description | A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.
Cette invention concerne une composition de pâte conductrice qui comprend (i) une poudre inorganique comprenant au moins une poudre conductrice, (ii) au moins un microgel polymère, et (iii) un solvant. La composition de pâte peut être utilisée dans un procédé de fabrication d'un dispositif électrique comprenant : la préparation d'un substrat ; l'application de la pâte conductrice sur le substrat selon un motif prédéfini ; et le chauffage de la pâte conductrice appliquée pour former une structure conductrice qui fournit une électrode pour raccorder le dispositif. La composition de pâte permet avantageusement de former des caractéristiques ayant un rapport d'aspect étroit, élevé dans la structure conductrice. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2016126801A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2016126801A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2016126801A13</originalsourceid><addsrcrecordid>eNrjZHB19vdzCXUO8QxzVQhwDA5xVXD29w3wD_YM8fT3U3D0c1EIdvX1hCryD1JwcQ3zdHYNVvB1dHFVCPFwDXIN9wzx4GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgaGZoZGZhYGho6GxsSpAgBbYy03</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH</title><source>esp@cenet</source><creator>TRAN, HOANG VI ; KIM, ESTHER ; CATIVO, MA HELEN ; SUMMERS, JOHN DONALD ; TAO, YUEFEI ; WOLFE, MICHAEL STEPHEN ; MATHER, BRIAN D ; SAUER, BRYAN BENEDICT ; LEE, HEE HYUN</creator><creatorcontrib>TRAN, HOANG VI ; KIM, ESTHER ; CATIVO, MA HELEN ; SUMMERS, JOHN DONALD ; TAO, YUEFEI ; WOLFE, MICHAEL STEPHEN ; MATHER, BRIAN D ; SAUER, BRYAN BENEDICT ; LEE, HEE HYUN</creatorcontrib><description>A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.
Cette invention concerne une composition de pâte conductrice qui comprend (i) une poudre inorganique comprenant au moins une poudre conductrice, (ii) au moins un microgel polymère, et (iii) un solvant. La composition de pâte peut être utilisée dans un procédé de fabrication d'un dispositif électrique comprenant : la préparation d'un substrat ; l'application de la pâte conductrice sur le substrat selon un motif prédéfini ; et le chauffage de la pâte conductrice appliquée pour former une structure conductrice qui fournit une électrode pour raccorder le dispositif. La composition de pâte permet avantageusement de former des caractéristiques ayant un rapport d'aspect étroit, élevé dans la structure conductrice.</description><language>eng ; fre</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160811&DB=EPODOC&CC=WO&NR=2016126801A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160811&DB=EPODOC&CC=WO&NR=2016126801A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TRAN, HOANG VI</creatorcontrib><creatorcontrib>KIM, ESTHER</creatorcontrib><creatorcontrib>CATIVO, MA HELEN</creatorcontrib><creatorcontrib>SUMMERS, JOHN DONALD</creatorcontrib><creatorcontrib>TAO, YUEFEI</creatorcontrib><creatorcontrib>WOLFE, MICHAEL STEPHEN</creatorcontrib><creatorcontrib>MATHER, BRIAN D</creatorcontrib><creatorcontrib>SAUER, BRYAN BENEDICT</creatorcontrib><creatorcontrib>LEE, HEE HYUN</creatorcontrib><title>CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH</title><description>A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.
Cette invention concerne une composition de pâte conductrice qui comprend (i) une poudre inorganique comprenant au moins une poudre conductrice, (ii) au moins un microgel polymère, et (iii) un solvant. La composition de pâte peut être utilisée dans un procédé de fabrication d'un dispositif électrique comprenant : la préparation d'un substrat ; l'application de la pâte conductrice sur le substrat selon un motif prédéfini ; et le chauffage de la pâte conductrice appliquée pour former une structure conductrice qui fournit une électrode pour raccorder le dispositif. La composition de pâte permet avantageusement de former des caractéristiques ayant un rapport d'aspect étroit, élevé dans la structure conductrice.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB19vdzCXUO8QxzVQhwDA5xVXD29w3wD_YM8fT3U3D0c1EIdvX1hCryD1JwcQ3zdHYNVvB1dHFVCPFwDXIN9wzx4GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgaGZoZGZhYGho6GxsSpAgBbYy03</recordid><startdate>20160811</startdate><enddate>20160811</enddate><creator>TRAN, HOANG VI</creator><creator>KIM, ESTHER</creator><creator>CATIVO, MA HELEN</creator><creator>SUMMERS, JOHN DONALD</creator><creator>TAO, YUEFEI</creator><creator>WOLFE, MICHAEL STEPHEN</creator><creator>MATHER, BRIAN D</creator><creator>SAUER, BRYAN BENEDICT</creator><creator>LEE, HEE HYUN</creator><scope>EVB</scope></search><sort><creationdate>20160811</creationdate><title>CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH</title><author>TRAN, HOANG VI ; KIM, ESTHER ; CATIVO, MA HELEN ; SUMMERS, JOHN DONALD ; TAO, YUEFEI ; WOLFE, MICHAEL STEPHEN ; MATHER, BRIAN D ; SAUER, BRYAN BENEDICT ; LEE, HEE HYUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2016126801A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2016</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>TRAN, HOANG VI</creatorcontrib><creatorcontrib>KIM, ESTHER</creatorcontrib><creatorcontrib>CATIVO, MA HELEN</creatorcontrib><creatorcontrib>SUMMERS, JOHN DONALD</creatorcontrib><creatorcontrib>TAO, YUEFEI</creatorcontrib><creatorcontrib>WOLFE, MICHAEL STEPHEN</creatorcontrib><creatorcontrib>MATHER, BRIAN D</creatorcontrib><creatorcontrib>SAUER, BRYAN BENEDICT</creatorcontrib><creatorcontrib>LEE, HEE HYUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TRAN, HOANG VI</au><au>KIM, ESTHER</au><au>CATIVO, MA HELEN</au><au>SUMMERS, JOHN DONALD</au><au>TAO, YUEFEI</au><au>WOLFE, MICHAEL STEPHEN</au><au>MATHER, BRIAN D</au><au>SAUER, BRYAN BENEDICT</au><au>LEE, HEE HYUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH</title><date>2016-08-11</date><risdate>2016</risdate><abstract>A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.
Cette invention concerne une composition de pâte conductrice qui comprend (i) une poudre inorganique comprenant au moins une poudre conductrice, (ii) au moins un microgel polymère, et (iii) un solvant. La composition de pâte peut être utilisée dans un procédé de fabrication d'un dispositif électrique comprenant : la préparation d'un substrat ; l'application de la pâte conductrice sur le substrat selon un motif prédéfini ; et le chauffage de la pâte conductrice appliquée pour former une structure conductrice qui fournit une électrode pour raccorder le dispositif. La composition de pâte permet avantageusement de former des caractéristiques ayant un rapport d'aspect étroit, élevé dans la structure conductrice.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO2016126801A1 |
| source | esp@cenet |
| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T03%3A30%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TRAN,%20HOANG%20VI&rft.date=2016-08-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2016126801A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |