COMMUNICATION DEVICE METAL HOUSING AND MANUFACTURING METHOD THEREOF

A method for manufacturing a communication device metal housing, the method comprising the following steps: 1) providing a metal housing, the metal housing comprising a metal base (100), and a plastic supporting layer (300) formed on an inner surface of the metal base; 2) etching via a laser to form...

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Bibliographische Detailangaben
Hauptverfasser:	LI, KONGLIN, ZHAO, GUIWANG, DONG, MINGJIE, GUO, LIFEN
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for manufacturing a communication device metal housing, the method comprising the following steps: 1) providing a metal housing, the metal housing comprising a metal base (100), and a plastic supporting layer (300) formed on an inner surface of the metal base; 2) etching via a laser to form a slit (200) on the metal base, the slit passing through the metal base and not passing through the plastic supporting layer; and 3) forming a decorative layer on an outer surface of the metal base. L'invention concerne un procédé de fabrication d'un boîtier métallique de dispositif de communication, le procédé comprenant les étapes suivantes: 1) la fourniture d'un boîtier métallique, le boîtier métallique comprenant une base métallique (100) et une couche de support en matière plastique (300) formée sur une surface interne de la base métallique; 2) la gravure par le biais d'un laser pour former une fente (200) sur la base métallique, la fente traversant la base métallique et ne traversant pas la couche de support