CIRCUIT BOARD WITH CONSTRAINED SOLDER INTERCONNECT PADS

Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a solder mask (75) on a circuit board (20) with a first opening (220) that has a sidewall. A solder interconnect pad (65) is formed in the first open...

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Bibliographische Detailangaben
Hauptverfasser:	LEUNG, ANDREW KW, TOPACIO, RODEN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a solder mask (75) on a circuit board (20) with a first opening (220) that has a sidewall. A solder interconnect pad (65) is formed in the first opening. The sidewall sets the lateral extent of the solder interconnect pad. La présente invention concerne diverses cartes de circuits imprimés et leurs procédés de fabrication. Selon un aspect, l'invention concerne un procédé de fabrication qui consiste à former un masque de soudure (75) sur une carte de circuits imprimés (20) comportant une première ouverture (220) pourvue d'une paroi latérale. Une pastille d'interconnexion de soudure (65) est formée dans la première ouverture. La paroi latérale définit l'étendue latérale de la pastille d'interconnexion de soudure.