LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING MODULE COMPRISING SAME

A light emitting device package according to an embodiment comprises: a package body; a lead frame arranged on the package body; and a light emitting device arranged on the lead frame; an adhesive member arranged between the light emitting device and the lead frame; and a resin layer surrounding the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KWON, JI NA
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A light emitting device package according to an embodiment comprises: a package body; a lead frame arranged on the package body; and a light emitting device arranged on the lead frame; an adhesive member arranged between the light emitting device and the lead frame; and a resin layer surrounding the light emitting device, wherein the package body comprises a resin and a volatile corrosion inhibitor which is mixed with the resin. Selon une forme de réalisation, l'invention concerne un boîtier de dispositif électroluminescent qui comprend : un corps de boîtier ; une grille de connexion aménagée sur le corps de boîtier ; et un dispositif électrolluminescent aménagé sur la grille de connexion ; un élément adhésif aménagé entre le dispositif électroluminescent et la grille de connexion ; et une couche de résine entourant le dispositif électrolluminescent. Le corps de boîtier comprend une résine et un inhibiteur de corrosion volatil qui est mélangé à la résine. 실시 예에 따른 발광 소자 패키지는 패키지 몸체; 상기 패키지 몸체 상에 배치되는 리드 프레임; 상기 리드 프레임 상에 배치되는 발광 소자; 상기 발광 소자와 상기 리드 프레임 사이에 배치되는 접착 부재; 및 상기 발광 소자를 포위하는 수지층을 포함하며, 상기 패키지 몸체는 수지 및 기화성 방청제를 포함하며, 상기 기화성 방청제는 상기 수지와 혼합된 형태이다.