SAPPHIRE COVER FOR ELECTRONIC DEVICES

A cover for an electronic device (100) and methods of forming a cover (112) is disclosed. The electronic device (100) may include a housing (102), and a cover (112) coupled to the housing (102). The cover (112) may have an inner surface (124) having at least one of an intermediate polish and a final...

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Bibliographische Detailangaben
Hauptverfasser:	KAMIREDDI, SRIKANTH, ZHANG, JING, CHINNAKARUPPAN, PALANIAPPAN, DE JONG, ERIK G, CAI, XIAO BING, KAMEI, SAWAKO, LEE, JONG KONG, MEMERING, DALE N, MIN, FENG, MYLVAGANAM, JEFFREY C, DU, XIANG, LIU, SAI FENG
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GLASS GRINDING HOROLOGY JOINING GLASS TO GLASS OR OTHER MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL MECHANICALLY-DRIVEN CLOCKS OR WATCHES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS PHYSICS POLISHING SOLDERING OR UNSOLDERING SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A cover for an electronic device (100) and methods of forming a cover (112) is disclosed. The electronic device (100) may include a housing (102), and a cover (112) coupled to the housing (102). The cover (112) may have an inner surface (124) having at least one of an intermediate polish and a final polish, a groove (128) formed on the inner surface (124), and an outer surface (126) positioned opposite the inner surface (124). The outer surface (126) may have at least one of the intermediate polish and the final polish. The cover (112) may also have a rounded perimeter portion (134) formed between the inner surface (124) and the outer surface (126). The rounded perimeter portion (134) may be positioned adjacent the groove (128). The method for forming the cover (112) may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove (128) of the sapphire component forming the cover (112) using blasting media (142). L'invention concerne un couvercle destiné à un dispositif électronique (100) et des procédés de formation d'un couvercle (112). Le dispositif électronique (100) peut comprendre un boîtier (102), et un couvercle (112) couplé au boîtier (102). Le couvercle (112) peut présenter une surface intérieure (124) ayant un poli intermédiaire et/ou un poli final, une rainure (128) pratiquée sur la surface intérieure (124), et une surface extérieure (126) située en regard de la surface intérieure (124). La surface extérieure (126) peut avoir le poli intermédiaire et/ou le poli final. Le couvercle (112) peut présenter également une partie périphérique arrondie (134) qui se trouve entre ladite surface intérieure (124) et ladite surface extérieure (126). La partie périphérique arrondie (134) peut être placée à proximité de la rainure (128). Le procédé de formation du couvercle (112) peut consister à exécuter un premier processus de polissage sur le saphir à l'aide d'un outil de polissage, et à exécuter un second processus de polissage sur la rainure (128) du saphir formant le couvercle (112) à l'aide de milieux de projection de particules (142).