POST CHEMICAL MECHANICAL POLISHING FORMULATIONS AND METHOD OF USE

A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of amines and ammonium-containing salts. The composition ac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MEDD, STEVEN, LIU, JUN, SUN, LAISHENG, ZHANG, PENG, BARNES, JEFFREY A
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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