MAINBOARD STRUCTURE AND TERMINAL
The present invention relates to the field of communications. Disclosed in an embodiment of the present invention are a mainboard structure and terminal, reducing the overall thickness of the terminal. The specific solution is: a mainboard structure comprising a printed circuit board (PCB) mainboard...
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Format: | Patent |
Sprache: | chi ; eng ; fre |
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Zusammenfassung: | The present invention relates to the field of communications. Disclosed in an embodiment of the present invention are a mainboard structure and terminal, reducing the overall thickness of the terminal. The specific solution is: a mainboard structure comprising a printed circuit board (PCB) mainboard, the PCB mainboard being provided with at least one hollow zone; the mainboard structure further comprises land grid array (LGA) modules each corresponding to the hollow zones; the area of a first surface of the LGA module is larger than the area of the hollow zone corresponding to the LGA module; the first surface of the LGA module comprises a first region and a second region, the first region corresponding to the hollow zone for disposing key high components, and the second region being electrically connected with the first surface of the PCB mainboard.
La présente invention se rapporte au domaine des communications. La présente invention concerne, dans un mode de réalisation, une structure et un terminal de car |
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