ELECTRONIC DEVICE PROVIDED WITH ELECTRICAL ELEMENT AND TEMPERATURE DETECTOR

The lower surface of a substrate is exposed from a sealing resin of this electronic device. A heat spreader, which is a heat dissipation material, is bonded to a surface of the substrate, said surface being on the reverse side of the lower surface (and hereinafter referred to as the upper surface),...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HOZUMI, NORIMITSU, NAKAGUCHI, MASAHISA, KIMURA, JUN'ICHI, KOHDA, SHINICHI
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS SEMICONDUCTOR DEVICES TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!