A PREDICTIVE METHOD OF MATCHING TWO PLASMA REACTORS

Etch rate distribution non-uniformities are predicted for a succession of hardware tilt angles of the RF source applicator relative to the workpiece, and the behavior is modeled as a non-uniformity function for each one of at least two plasma reactors. An offset Δα in tilt angle α between the non-un...

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Bibliographische Detailangaben

Hauptverfasser:	SARAF, GAURAV, KHAN, ANISUL, H, YANG, XIAWAN, ABOOAMERI, FARID, CHANG, WEN, TEH, HERSCH, BRADLEY, SCOTT
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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