PHOTOELECTRIC CONVERSION ELEMENT AND METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION ELEMENT

A photoelectric conversion element (10) provided with a substrate (12) and a film formation layer (13) deposited on the surface of the substrate (12), the film formation layer (13) having, on a peripheral edge part, at least one cutout part (14) on which no deposition takes place. The film formation...

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Bibliographische Detailangaben
Hauptverfasser:	OKABE, KATSUYA, KAWAMOTO, KUNIHIRO
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A photoelectric conversion element (10) provided with a substrate (12) and a film formation layer (13) deposited on the surface of the substrate (12), the film formation layer (13) having, on a peripheral edge part, at least one cutout part (14) on which no deposition takes place. The film formation layer (13) is formed using a photoelectric conversion element film formation mask having an opening defining a film formation region and having at least one substrate-holding protrusion protruding from the peripheral edge part of the opening towards the inside of the opening. The cutout part (14) is formed at a position on the photoelectric conversion element film formation mask corresponding to the position of the substrate-holding protrusion. 　L'invention concerne un élément de conversion photoélectrique (10), comprenant un substrat (12) et une couche de formation de film (13) déposée sur la surface du substrat (12), la couche de formation de film (13) ayant, sur une partie de bord périphérique, au moins une partie de découpe (14) sur laquelle on ne peut placer de dépôt. La couche de formation de film (13) est formée en utilisant un masque de formation de film d'élément de conversion photoélectrique ayant une ouverture définissant une région de formation de film et ayant au moins une saillie de maintien de substrat dépassant de la partie de bord périphérique de l'ouverture vers l'intérieur de l'ouverture. La partie de découpe (14) est formée au niveau d'une position du masque de formation de film d'élément de conversion photoélectrique correspondant à la position de la saillie de maintien de substrat.