PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

In a plasma film-forming apparatus (100), a supplementary plate (9) as a protruding section is mounted on substantially the whole non-placing region (R2) of a lower electrode (5). The supplementary plate (9) has a frame shape, and is disposed to surround the whole rectangular placing region (R1). Th...

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Bibliographische Detailangaben
Hauptverfasser: HUKUDA TOMOHIRO, DEMICHI KIMIHIKO, KOHAMA NORIYOSHI
Format: Patent
Sprache:eng ; fre ; jpn
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